Sn99/Ag0.3/Cu0.7 SMD Welding Paste217°C High Temperature Lead-free No Clean Solder Paste For Phone Component Repair
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Product details
| Management number | 218785092 | Release Date | 2026/05/03 | List Price | US$4.91 | Model Number | 218785092 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
- Lead-Free Solder Paste Content: Alloy Tin 99% Ag 0.3 Cu0.7%, Solder Flux Content: 10.5%
- Product Parameters: Total Weight: 50g
- Paste Features: Lead-Free, No Clean, Strong Viscosity, Bright Welding Point
- Package Includes: A Bottle of Solder Paste
- Paste Features: Lead-Free Solder Paste - Low Temperature Solder Paste With Flux, Melting Point: 218°C
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance
| Item Weight | 3.2 ounces |
|---|---|
| Manufacturer | SoPagre |
| Power Source | NK |
| Item model number | MN-008 |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 6.65 x 4.13 x 1.65 inches |
| Included Components | 1 Set Solder Paste |
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